Recently, Henan Huanghe Whirlwind Co., Ltd. has made a breakthrough in the development of a diamond wire for silicon carbide cutting. After being used by multiple customers, its product performance has fully met or even exceeded the level of similar products in Japan. It is significantly better in terms of cutting efficiency, cutting quality, and cutting stability, and is superior to the current level of mortar cutting.
In recent years, the development of the third-generation semiconductor industry, represented by gallium nitride and silicon carbide, has been rapid. The country attaches great importance to it, and enterprises actively lay out, presenting an explosive growth trend for the entire industry. As one of the third-generation semiconductors, silicon carbide material has excellent performance and is also difficult to process due to its high hardness and brittleness. Its high hardness and brittleness make processing difficult, risky, inefficient, and have low yield rate, especially in cutting. Currently, diamond mortar cutting is mainly used in the market, with slow cutting speed, low efficiency, low mortar utilization rate, high cost, and the supply of mortar micro-powder has reached its limit. It has become an inevitable trend to replace mortar cutting with solidified diamond wire.
At present, only a Japanese company can stably supply silicon carbide cutting wires in the market. Against the background of the suppression of China's chip industry by the United States and Japan, the domestication of silicon carbide cutting diamond wires is particularly urgent. However, silicon carbide wafers have high value and require low-risk and high-quality cutting, which makes the quality requirements for diamond wires extremely strict.
As a leading enterprise in superhard materials, Huanghe Whirlwind fully leverages the advantage of covering the entire industry chain, and collaborates with multiple departments to use the diamond wire equipment and technology introduced from Sumitomo in Japan. It conducts in-depth research on the cutting mechanism of diamond wire saws for silicon carbide, focusing on exploring the failure mechanism of diamond during cutting. It is adapted to special diamond and micro-powder to ensure the excellent cutting ability and stability of the material and product quality.
Huanghe Whirlwind's diamond wire for silicon carbide cutting has even wire diameter, good wire circularity, uniform abrasive distribution, and high blade yield.
During the cutting process of 6-inch insulated and conductive silicon carbide crystals, the diamond wire has a small wire bow, no wire breakage, and the cut surface is smooth without wire marks. The amount of wire used for cutting is between 500-800m per piece.
After being verified by multiple customers for cutting use, the diamond wire shows uniform diameter wear and stable cutting data. It can achieve the same quality of chip cutting as diamond mortar cutting and greatly improve cutting efficiency while reducing production costs.